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Sent:                               Friday, April 15, 2016 10:28 AM

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This resume has been forwarded to you at the request of Monster User xapeix03

Michael Greene 

Last updated:  12/26/14

Job Title:  no specified

Company:  no specified

Rating:  Not Rated

Screening score:  no specified

Status:  Resume Received


Modesto, CA  95355
US

Mobile: 415-602-1550   
ohms_law_ir_equals_v@yahoo.com
Contact Preference:  Email

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RESUME

  

Resume Headline: Sr. Electronics Engineering tech/ Field Engineer

Resume Value: wvyngrana7enrjy7   

  

 

M.A.Greene

415-602-1550

E-mail:ohms_law_ir_equals_v@yahoo.com

 

 

ObjectiveTo secure a position as an Electronic Engineering Technician, with an opportunity to apply my expertise and skills in troubleshooting, circuit construction and field service repair.

 

Professional Experience

July18, 2010 –Present      Lockheed-Martin IS&GS, Melbourne, FLA. 32904

Field Service Engineer and site manager

Responsible for the ground preparation prior to receiving the Aerostat and support modules.

Designed the grounds architecture and systems layout plan.  

Stationed in Afghanistan, duties entailed the servicing and maintenance of the Aerostat aerial surveillance system.

·               As Field Engineer:

o        Performed field installations, modifications, maintenance and repairs.

o        Set up systems’ navigation, GPS, Network/ fiber optics.

o        Payload power distribution systems, Transformers and georator.

o        Avionics power, IFF, Strobe electronics, ELT, FTS.

o        OSRVT, Pressure control systems, Hydraulic system and pumps.

o        CLAW2 , HARC and SINCGAR.

o        Mounted and tested payloads. ACE, ASHS, EPSE, PAU.

o        Performed electronics troubleshooting on all boards in systems.

o        Repaired tether and fiber optics.

o        Ran all cables and hoses.

o        Repaired slip rings in the joining power distribution system.

o        Set up UTAMS , storm scope and COHU surveillance camera system.

·               Site Lead and Manager. Duties entail:

o        Supervising a team of 12 .

o        Approving site situation and preparing site for the reception of base equipment.

o        Measuring and leveling base area. Designing base and compound layout.

o        Erecting Ground command station and TMOS, Storage areas, living quarters, generator and helium bays, and Aerostat modular platform, and setting up of bomb shelter concrete structures.

o        Inflation of Aerostat and payload test and mounting.

o        Training site personal on electronics and preventative maintenance procedures.

o        Training in fiber optic splicing and HV power routing and repair.

o        Training crew on launch and recovery of Aerostat.

 

Developed a basic proof of concept NDT Ultrasonic tool for finding Aerostat breaches while under hostile conditions. Tool shortens the time it takes to find holes even in low light or no light conditions.

 

I presently have both a passport and secret clearance.

 

Oct.28, 2008 – Feb.12 2010 General Atomics ASI , Palmdale , CA.

Avionics Technician UAV Predator A

Duties involve the maintenance and servicing of the Predator UAV and GCS.

·             Performed scheduled maintenance.

·             Ran all tests for functionality and compliance. From control surfaces to C-Band and Ku.

·             Loaded software and tested on both aircraft and ground station.

·             Read and use schematics for trouble shooting issues.

o       Use of meters, o-scopes, spectrum analyzers and hand tools.

o       PCM,IFF, SPMA, Enerdyne, Arc210 radio, Ku and C band antennas , Missile controller

o       SCM , Batteries, FSU, LN100g , EO/IR camera, MTS ball (installing and testing only)

·             Predator A  Model type Block 10 and 15

·             Ground Control Station (GCS)

I presently have both a current passport and a security clearance.

 

Oct. 17,2005-Jan. 25, 2008 Aviza Technologies, Scotts Valley, CA.

Field Service Engineer

Duties entailed equipment installation, repair and maintenance of semiconductor fabrication equipment.

·            Diffusion furnaces VTR and AVP.

·            Deposition tools - Delta.

·            Etch tools - Omega.

·            Robot arm transportation assemblies.

·            Performed field modifications and upgrades.

·            Troubleshooting of power systems, controls, and chemical delivery and transport systems.

·            Electronics troubleshooting of boards and components.

·            Able to perform on site training and remote customer service.

Jan. 15, 2003 – Jan. 10, 2005FSM, San Jose, CA

Field Service Engineer

Responsible for performing the final test, troubleshooting, installation, and training for the 413 Echo Probe film thickness measurement tool.

·            Created test jigs for standardizing final test.

·            Documented and devised new assembly methods.

·            Troubleshot circuits to board and component level. Both analog and digital circuits.

·            Aided in instrumentation design and construction.

·            Board assembly.

·            Test, troubleshoot and maintain laser assembly systems.

·            Wrote the technicians’ manual for the installation and trouble shooting of the tool.

·            Performed customer training and wrote basic training guides.

·            Created and documented the laser and fiber optic alignment procedures.

·            Power measurement and system troubleshooting.

·            Procured parts and equipment for the development lab.

o       Oscilloscopes, spectrum analyzer, and power meters.

o       Laser diodes, optics, and power supplies.

o       Beam splitters, couplers, lens, and CCD cameras.

·            Performed equipment installations and client training in Malaysia and Singapore.

·            Prototyped circuits using MultiSim and Orcad circuit simulators.

·            Worked with various wafer handling robotic arms.

April18, 2001 – Dec. 15, 2002  Neo PhotonicsFremont, CA

Research Associate     Advanced Technology Group

Personal accountabilities were for the continued advancement of the Alpha tool’s LRD deposition nozzle, precursor process kit, flow visualizations, and electronic controls and modifications.

·             Responsible for the constructing of mechanical jigs and test platforms for HWA tests.

·             Built electronic and mechanical prototypes. And constructed electronic instrumentation.

·             Aided in new equipment design. Both the mechanical and electronic aspects.

·             Ran engineering tests, detailed experiments and prepared presentation materials.

·             Built and designed small and micro sized CCD and CMOS camera systems for recording laser experiments. Designed small power supplies for cameras and interface modules.

·             Set up and ran hot wire anemometry system for system turbulence measurements. Also functioned as in house repair tech for HWA problems and was primary contact to the manufacturer for all extensive repairs, pm’s, and upgrades.

·             Operated Rf equipment and inductive furnaces.

·             Used circuit simulator software to design various test fixtures, equipment, and process aids.

·             Troubleshooting circuits down to the component level, both analog and digital.

·             Developed process kit models that demonstrated improved precursor flow to and from the wafer.

·             Developed methods for flow vectoring of particles inside of the process kit.

·             Developed electronic controls for RTP concept test platform.

·             Created plans for new flow chamber assemblies.

August 2000 – April 2001Butler Technical Group

August 2000 – April 2001 KLA-Tencor [Contract] Santa Clara, CA

ATE[Associate Test Engineer]

Responsible for the final test of the Fast divisions Stress testing machines.

Worked on the Flexus family, which entailed the following systems.

FLX 5500, FLX 5400, FLX 2320, and FLX 2908.

·             Performed Set up and calibration of the systems’ lasers and on-board electronics.

·             While there, I suggested several innovations and adjustments to the testing process, which improve the stability of the equipment and reduced testing time.

·             Devised an alignment jig for simplifying the alignment of the system’s two lasers.

·             Contributed to the further refinement of the Final test procedural / instructional document to be used for future ATE’s aid and training.

·             Made observations to engineer on crystal beam splitter placement for easier and more consistent alignment.

·             Engaged in electronic circuit board testing down to the component level.

·             Also performed first level training for new hires.

·             Work with wafer handling robotic arms and wafer alignment tools.

 

1989 - 1998   Intel Corporation

May 1995 to 1998 CA/T Military Group Chandler, AZ

Senior Manufacturing Technician

·             Maintain, troubleshot, and repair of all test floor equipment.

·             Revise specs and operational documentation for test floor personnel.

·             Equipment owner of the Varian 947 leak detection system. Performed full dismantlement and reassembly, test, calibration, and troubleshooting. Also worked with turbo pumps and diffusion pumps.

·             NID and              WEB hermeticity systems. Picked by vendor as technician of choice

to assist in P.M. training for other technicians on the Varian leak detection equipment.

·             Project Manager for T7 RFC development team.

·             Test floor equipment:              Trillium MM+, J941, Sentry, Genesis, S9K.

MCTs 3608c, 3608e, 4610, 4015. Varian 947 leak detector, WEB,

NID, SDH/NGC, Delta Flex, U.E. System Ultrasonic tester.

 

April 1990 - May 1995CTM/SVC and D2Santa Clara, CA

Equipment Engineering Services Technician

·             Maintained, troubleshot, and repaired all test floor equipment, as well as

Covering the finish area and D2 tools. Received award for participation

On JLSI component handler improvement team. Was further

recognized for experiments and studies done on setup standards

and their mechanical fatigue and failure. The resolution of this project

was instrumental in cutting the equipment set up time by 50%, with a

Significant reduction in setup failures.

·             Troubleshooting electronic components to board level. Both analog and digital systems and circuits.

·             Set up, ran , and tested cryogenic systems and vacuum pumping equipment.

·             Test floor equipment: Trillium Micro Master plus and Delta Master,

·             Genesis Megatest, S9K, HP 4062UX, JLSI, YAG laser, Markem 530

·             Electroglas 2001,2010,3001,4085. Kensington Lot splitter, Recif  wafer handler

·             OCR, BLU, RVSI.

ERT Co- Captain and safety team member.

 

August 1989 - April 1990 FAB1Santa Clara, CA

Diffusion Technician

·             Maintained the diffusion furnaces TMX 9K & 10K. Supported auto loaders and cvd Plotters.

·             Also supported the fab’s first Automatic Wet Station robotic wafer processing system bay. I performed both    maintenance, alignment, and repair.

·             Bulk chemical delivery system. Fortran wafer boat loader/Unloader.              Plus a large variety of high              Vacuum pumps. In the eight months of residence in the Fab, eleven projects were               completed.

·             Member of the SC7/9 ERT team.

 

1984 - 1989Xerox CorporationNYC, NY

Field Service Technician

·             Service the mid volume copier models for a territory of over 90 client sites.

Tested high voltage power supplies. Performed p.m.’s, calibrations, and repairson the electronic, and electromechanical subassemblies.

 

1982 - 1984U.E. SystemsElmsford, NY

Prototype & AssemblyTechnician

·             Built and tested the company’s complete line of nondestructive ultrasonic testing               equipment. Maintained the engineering lab and all test equipment. Designed test              jigs and made special measuring tools for the ultrasonic sensors.

·             Improved the company’s quality assurance methodology and programs.

 

Personal Endeavors and ongoing projects:

·   Designing aid application for electronic engineering technicians to aid in basic circuit design and standardize troubleshooting.

·   Designed a laser beam splitter alignment tool for a wafer surface metrology system that reduced the set up time from 15 minutes to between 4 and 5 minutes.

·   Designing UAV system for use in precision agriculture.

·   Developed an NDT Ultrasonic tool for use in quick breach location under hostile conditions.

o   Made a quick test tool using quad op-amp ic and a heterodyne method to convert the ultrasonic sound down to human range.

o   2nd phase is to convert circuitry to use microcontroller, laser diode ranging , ambient temperature and a “Look Up” chart to detect possible helium leaks inside of the aerostat.( Concept is to measure the change of the signal’s speed.)

 

Skills and expertise:

·   Use of Test equipment- O-scopes, DVM, Signal generators, Frequency generators. Semiconductor testers. Wafer handlers.

·   Fiber optic splicers.

·   Vacuum systems .

·   Read electronic Schematics.

·   Troubleshoot to board and component level.

·   Use circuit simulators: Multisim and Labcenter Proteus.

·   Some basic FLOWCODE microcontroller sim/program software.

·   Able to use clear methods to improve efficiency on the test floor , lab and design room.

·   Able to work well in stressful environments.

TESOL/TESL/TEFL Cert.

Speaks basic Portuguese

 

 

 

Education

1974-1977Mohawk Valley Community CollegeUtica, NY

Electronic Technology

Courses: DC/AC circuits. Analog and digital circuits, fundamentals of control systems

and Electromechcanics  . Technical calculus, drafting, and basic programming.

1980 - 1982City College School of EngineeringNYC, NY

Furthered my studies in physics analytic mechanics, and electromagnetism.

Calculus, differential equations, linear algebra, and Fortran Watfiv. Chemistry, history, and art.

 

1992 – 1993   Foothill Community CollegeLos Altos Hills, CA.

Courses taken in: Electronics, Math, Visual Basic, Philosophy, Photography

1989 - 1999   Intel U

Hazcom safety and area wrap up, TMX 10K phase I, CPR, Ranger - scba, Trillium,

Schlum ITS 9K FX, Electrical Safety, Visual Basic, JAVA programming, MS FrontPage,

Varian Vacuum Introduction- Advanced - and 947 leak detector, Laser principles,

NGC/SDH handler class.

 

I have a current passport and presently hold a security clearance.

PLC, circuit design, medical laser repair, laser repair, electronics, electronic controls, electronics circuit design, drones, predator drone, diffusion furnaces, research and design, engineering technician, field engineer ,  military contractor, Iraq, Afghanistan, RF tech, Electronics Technician, Vacuum Technician, Avionics



Experience

BACK TO TOP

 

Job Title

Company

Experience

Field Engineer

Lockheed Martin Integrated Systems, Inc.

- Present

 

Additional Info

BACK TO TOP

 

Current Career Level:

Experienced (Non-Manager)

Years of relevant work experience:

10+ to 15 Years

Date of Availability:

Within one month

Work Status:

US - I am authorized to work in this country for any employer.

Active Security Clearance:

Active Secret

US Military Service:

Citizenship:

US citizen

 

 

Target Job:

Target Job Title:

Field Engineer

 

Target Company:

Company Size:

Occupation:

Engineering

·         Electrical/Electronics Engineering

·         Systems/Process Engineering

 

Target Locations:

Selected Locations:

US-CA-Sacramento

Relocate:

Yes

Willingness to travel:

Up to 75% travel

 

Languages:

Languages

Proficiency Level

Brazilian Portuguese

Intermediate

English

Fluent